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Custom Hardware Solutions

2025-05-14 14:40:47

Custom Hardware Solutions are non-standard hardware systems or components tailored to specific customer needs. These solutions range from circuit boards, processor modules, industrial control equipment, embedded systems, to mechanical structural parts, connectors, housings and other physical components, and are widely used in industrial automation, medical equipment, communication systems, automotive electronics, aerospace and other fields.


Unlike general hardware products, Custom Hardware Solutions emphasizes high adaptability, exclusive design, high performance and scalability, and often cooperates with software system integration to achieve complete solutions.


2. Features

1. Highly customized and personalized design

Description: Exclusive design based on customer specific functional requirements, space dimensions, electrical interfaces, environmental conditions and other parameters.


Professional data:


Dimensional tolerance control range can reach ±0.05 mm


Electrical interface supports multiple standards, such as USB 3.2, RS-485, CAN, EtherCAT, etc.


Signal integrity can reach SNR > 90 dB (especially critical for stable transmission of high-frequency signals)


Technical advantages: Solve special needs that standard hardware cannot meet, such as ultra-high temperature resistance, ultra-small size, specific frequency band operation, etc.


2. High-performance directional optimization

Description: The system design is centered on achieving specific performance, such as high-bandwidth processing, low-latency control, strong anti-interference, etc.


Professional data:


Industrial control motherboard can integrate FPGA/ARM Cortex-A72, with a maximum main frequency of 2.4 GHz


Storage expansion can support PCIe NVMe SSD, data transmission rate > 3000 MB/s


EMI anti-interference design complies with EN 61000-6-4 standard


Technical advantages: Ensure system operation stability and efficiency, especially suitable for tasks in data-intensive or extreme environments.


3. Modular and scalable structure

Description: The hardware structure and interface design can be flexibly combined to meet the expansion needs of future upgrades or different applications.


Professional data:


Supports multi-slot expansion, such as Mini PCIe, M.2, GPIO, SIM slot, etc.


Module replacement time is less than 2 minutes, and MTTR (mean time to repair) is significantly reduced


Technical advantages: Improve system life cycle flexibility and support rapid iteration or on-demand function expansion.


4. Adaptability to harsh environments

Description: Designed for complex use environments such as industry, military, and outdoor to ensure reliability.


Professional data:


Operating temperature range: -40°C ~ +85°C


IP protection level up to IP67 (dustproof and waterproof)


Vibration resistance meets MIL-STD-810G test standards


Technical advantages: Maintain continuous and stable operation under harsh working conditions, widely used in outdoor control, rail transit, unmanned systems and other fields.


5. Integrated design and system compatibility

Description: Not only hardware design, but also integration with the customer's original software, communication protocol, and system platform must be considered.


Professional data:


Supports mainstream operating systems, such as Linux, RTOS, and Windows Embedded


Communication compatibility test pass rate reaches 99.8% (including Modbus, OPC UA, MQTT, etc.)


Technical advantages: Achieve "software and hardware integration" to avoid resource conflicts and compatibility issues in system integration.


III. Application scenarios

1. Industrial automation system

Customized controllers, acquisition modules, and communication nodes are used in automated production lines;


Specific interfaces can connect PLCs, sensors, and actuators;


Achieve high-speed data acquisition (such as ≥1MSPS), edge computing, and local intelligent control.


2. Medical electronic equipment

Such as customized ECG acquisition boards, blood sugar detection modules, and ultrasonic sensor control boards;


Meet high electrical safety (IEC 60601-1), EMC, and low power design requirements;


Support BLE/LoRa communication, suitable for remote health monitoring equipment.


3. Intelligent transportation and vehicle systems

Customized T-Box communication modules, ADAS control hardware, and vehicle Ethernet switch boards;


The operating temperature can adapt to the automotive requirements of -40°C to 105°C;


Meet ISO 26262 functional safety and CAN-FD communication protocols.


4. Aerospace and military systems

Designed for high-strength hardware for flight data recorders, navigation equipment, and tactical terminals;


Comply with RTCA DO-160 or MIL-STD-461 electromagnetic compatibility test standards;


Requires redundant design and long-life components (≥100,000 hours).


5. Internet of Things and edge computing scenarios

Customized IoT gateways and edge node devices, integrated with multi-protocol communications (Wi-Fi, Zigbee, NB-IoT);


With local computing and caching functions, reducing cloud load;


Applicable to smart factories, building security, smart agriculture, etc.


IV. Care and maintenance recommendations

1. Regular firmware and driver updates

Ensure compatibility with the system or application and fix vulnerabilities;

It is recommended to check for updated patches every quarter;

Automatic backup and rollback mechanisms should be enabled for key control devices.


2. Hardware dust and heat management

Install dust covers or air filters to prevent particles from entering the circuit;

For active heat dissipation structures, regularly check whether fans and heat sinks are blocked;

Use thermal conductive silicone grease and replace it every 12 months to ensure heat conduction efficiency.


3. Environmental monitoring and abnormal alarm mechanism

Deploy temperature, humidity, voltage, and current monitoring modules;

Support SNMP and MQTT protocol alarm systems, which can automatically issue alarms or remotely cut off power protection when abnormalities are found;

Especially suitable for long-term unattended places such as data centers and outdoor base stations.


4. Periodic inspection and replacement of key components

For example, lithium battery modules, electronic capacitors, connectors, etc. are recommended to be replaced every 2 to 3 years;


Use a thermal imager to detect overheated areas to prevent solder joints from melting or chips from burning;


Interfaces that are frequently plugged and unplugged, such as HDMI and RJ45, are recommended to have a service life of > 10,000 times to prevent poor contact.


Next: Stamping Mold Parts 2025-05-14

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+86 189 2682 6341

Block 1, No. 12, Wusong 4th Street, Yuwu Industrial Zone, Dongcheng District, Dongguan, Guangdong, China

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